Pierre Perrin-Monlouis Dernière mise à jour: 20 octobre 2021
Low-power, high-performance CPUs, chipsets and graphics deliver numerous new technical options, benefits of x86, and ease of a single source
SAN JOSE, Calif. —4/26/2010
At Embedded Systems Conference today, AMD (NYSE: AMD) announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. ⃰ AMD’s new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.
“The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon,” said Buddy Broeker, director, Embedded Solutions Division, AMD. “AMD’s embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion™ technology products into the embedded space.”
Embedded industry leaders support the benefits of AMD’s approach to x86 and complete platform solutions in the market. Read what customers iBASE and Quixant have to say about AMD Embedded Solutions.
New Platform Features
Faster memory with support for 2 channels DDR3
Improved I/O for high-throughput and real-time applications with available HyperTransport™ 3.0 technology
ECC for high-reliability applications like SMB/SOHO storage systems
Multiple CPU options that offer wide choice of performance and power
Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
Single-, dual- and quad-core
Up to 2.8 GHz
AMD 785E chipset with support for PCI Express® 2.0
New ATI Radeon™ HD 4200 graphics with DirectX® 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs
iBASE guest blog post
Quixant guest blog post
[email protected] blog
Advanced Micro Devices (NYSE: AMD) is an innovative technology company dedicated to collaborating with customers and technology partners to ignite the next generation of computing and graphics solutions at work, home and play. For more information, visit http://www.amd.com.
AMD, the AMD Arrow logo, AMD Athlon, AMD Fusion, AMD Sempron, Radeon, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
*Internal testing of current vs. previous generation AMD processor-based embedded systems as of April 1, 2010, showed up to 74% performance-per-watt advantage for the current generation. Current system: AMD Athlon™ II Neo R34L (8W TDP), Bimini development platform, AMD 785 Chipset, 2 GB RAM, Windows XP SP2. Previous generation: AMD Sempron™ 2010U processor (15W TDP), MSI 9858 motherboard, 2 GB RAM, Windows XP SP2. Performance-per-watt calculated based on geometric mean of three benchmarks divided by processor thermal design power (TDP). Benchmarks: 3DMark®06; POV-Ray; and SiSoftware Sandra 2007 (Processor Arithmetic, Memory Bandwidth, and Performance Index subtests).